The objects in this MIB module are used to manage the Ethernet-based multi-pair bonded xDSL interfaces, as defined in ITU-T Recommendation G.998.2 (G.Bond/Ethernet). This MIB module MUST be used in conjunction with the GBOND-MIB module, common to all G.Bond technologies. The following references are used throughout this MIB module: [G.998.2] refers to: ITU-T Recommendation G.998.2: 'Ethernet-based multi-pair bonding', January 2005. [G.998.2-Amd2] refers to: ITU-T Recommendation G.998.2 Amendment 2, December 2007. [802.3] refers to: IEEE Std 802.3-2005: 'IEEE Standard for Information technology - Telecommunications and information exchange between systems - Local and metropolitan area networks - Specific requirements - Part 3: Carrier Sense Multiple Access with Collision Detection (CSMA/CD) Access Method and Physical Layer Specifications', December 2005. [TR-159] refers to: Broadband Forum Technical Report: 'Management Framework for xDSL Bonding', December 2008. Naming Conventions: BACP - Bonding Aggregation Control Protocol BCE - Bonding Channel Entity BTU - Bonding Terminating Unit BTU-C - Bonding Terminating Unit, CO side BTU-R - Bonding Terminating Unit, Remote Terminal (CPE) side CO - Central Office CPE - Customer Premises Equipment GBS - Generic Bonding Sub-layer HDLC - High-level Data Link Control PTM-TC - Packet Transfer Mode Transmission Convergence (sub-layer) SNR - Signal to Noise Ratio TC - Transmission Convergence (sub-layer) UAS - Unavailable Seconds Copyright (c) 2013 IETF Trust and the persons identified as authors of the code. All rights reserved. Redistribution and use in source and binary forms, with or without modification, is permitted pursuant to, and subject to the license terms contained in, the Simplified BSD License set forth in Section 4.c of the IETF Trust's Legal Provisions Relating to IETF Documents (http://trustee.ietf.org/license-info).